Accessoires/Options for IONIX® HV and UHV sputtering sources:

IONIX® sputtering sources offer a wide variety of mechanical mounting options, including individual source chimneys, tilts, pneumatic, electric or manual shutters, gas distribution, quick coupling feedtrough and z-manipulators. The IONIX® modular approach enables various configurations to fit virtually every application need and vacuum requirement whether it is a new deposition system or a retrofit one.

 

 Shutter

IONIX® sputtering sources can be outfitted with a either manual or pneumatic driven shutter. Both swing- and flip type shutters are available.

Individual source shutters protect targets from cross-contamination if several sputtering sources are used. Also the chamber walls can be protected during conditioning of the target.

 


Chimney 

All IONIX® sputtering sources can be outfitted with either a conical or a cylindrical chimney. Both, chimneys welded to the anode and chimney screwed to the anode are available.

Chimneys avoid cross-contamination if several sputter sources are used in a multi-source configuration. In addition gas rings are incorporated in the chimney base.


Tilt/insitu tilt

IONIX® sputtering sources can be outfitted with tilt allowing confocal sputtering with several sources in a multi-source configuration. In addition a tilt allows the tuning of the source-to-substrate incident angle to achieve good film thickness homogeneity if target-to-substrate distances, working pressures and target materials are changed. Optionally insitu-tilts are available enabling tilting without breaching the vacuum inside the chamber.

 

Gas distribution

To supply sputter or reactive gases to IONIX® sputtering sources a gas tube connecting the gas inlet of the magnetron with the gas inlet on the chamber wall or flange can be foreseen. In case of a confocal configuration with tilted sputtering source the gas tube has the ability to adjust its length.


Quick coupling feedtrough

Quick coupling feedtroughs are available for mounting IONIX® sputtering sources on tubes OD 3/4'', OD 1'' and OD1.25'' through baseplate/flange holes in size 25.4 mm, 32 mm and 40 mm. A quick coupling feedtrough allows easy adjustment of target-to-substrate distance without breaking the vacuum inside the chamber.


Z-shift/Manipulator

Where precise and reproducable target-to-substrat distances are neccesary, or UHV-conditions are required a z-shift/manipulator is needed.

A z-shift allows easy adjustment and reproducability of target-to-substrate distance without breaking the vacuum inside the chamber.

 

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